[1]. B. Yan, J. Liang, Y. Shen, S. Wang, J.Huang, Thin Solid Films 549 (2013) 159-164.
[2]. W. Gao, M. Cao, J. Yang, J. Shen, J. Huang, Y. Zhao, Y. Sun, L. Wang, Y. Shen, Mater. Lett. 180 (2016) 284-287.
[3]. A. Kergommeaux, J. Faure-Vincet, A. Pron, R. Bettignies, P. Reiss, Thin Solid Films 535 (2013) 376- 379.
[4]. L. Ren, Z. Jin, W. Wang, H. Liu, J. Yang, Z. Hong, Appl. Surf. Sci. 258 (2011) 1353-1358.
[5]. V.S.R.R. Pullabhotla, M. W. Mabila, Mater. Lett. 183 (2016).
[6]. X. Xu, C. Takai, T. Shirai, M. Fuji, Adv. Powder Technol. 26 (2015) 1327-1334.
[7]. D. Das, R.K. Dutta, J. Colloid Interface Sci. 457 (2015) 339-344.
[8]. H. Tao, X. Yang, L. Zhang, S. Ni, J. Electroanal. Chem. 728 (2014) 134-139.
[9]. S. Chang, G. Conibeer, Thin Solid Films 520 (2011) 837-841.
[10]. M.G. Sousa, A.F. da Cunha, P.A. Fernandes, J. Alloys Compd. 592 (2014) 80-85.
[11]. H. Kafashan, M. Azizieh, H. Nasiri Vatan, J. Alloys Compd. 686 (2016) 962-968.
[12]. T.H. Sajeesh, Anita R. Warrier ,C. Sudha Kartha, K. P. Vijayakumar, Thin Solid Films 510 (2010) 4370-4374.
[13]. P. Sinsermsuksakul, J. Heo, W. Noh, Adam S. Hock, Roy G. Gordan, Adv. Energy Mater. 1(2011) 1116-1125.
[14]. H. Y. He,J. Fei, J. Lu, Mater. Sci. Semicond. Process. 24 (2014) 90-95.
[15]. K. G. Deepa, J.Nagaraju, Mater. Sci. Semicond. Process. 27 (2014) 649-653.
[16]. M. Jayachandran, S. Mohan, B. Subramanian, C. Sanjeeviraja, V. Ganesan, J. Mater. Sci. Lett. 20 (2000) 381-383.
[17]. H. Kafashan, M. Azizieh, Z. Balak, Appl. Surf. Sci. 410 (2017) 186-195.
[18]. J. Henry, K. Mohanraj, S.Kannan, S. Barathan, G. Siva Kumar, Eur. Phy. J.Appl. Phys.61 (2013)1030 p1–p4.
[19]. S. Zang, S. Chang, H. Jia, H. Zhou, Adv. Mater. Res. 418-420 (2012) 712-716.
[20]. H. Kafashan, R. Ebrahimi- Kharizsangi, F.Jamali- Shaini, R. Yousefi, Phys. Status Solidi A 213 (2016) 1302-1308.
[21].G. Yanhui, G. Yu-ying, S. Wei-min, Q. Yang-hua, W.Guang-Pu, J. Shangai Univ.11 (2007) 403-406.
[22]. H. Weihui, C.Shuying, Z. Hosfang, ECS Transactions 44 (2012) 1295-1301.
[23]. P. Thiruramanathan, G. S. Hikku, R. Krishna Sharma, M. Siva, Shakthi, Int. J. Technochem Res. 1 (2015) 59-69.
[24]. H. Kafashan, F. Jamali- Shaini, R. Ebrahini- Kharizsangi, R. Yousefi, J. Alloys Compd. 681 (2016) 595-605.
[25]. W. Albers, C. Hass, H. J. Vink, J. D. Wasschar, J. Appl. Phys. 32 (1961) 2220-2225.
[26]. M. Devika, N. Koteeswara Reddy, K. Ramesh, K. R. Gunasekhar, E.S.R. Gopal, K.T. Ramakrishna Reddy, J. Electrochem. Soc.153 (2006) G 727-733.
[27]. P. Lu, H. Jia, S. Cheng, Adv. Mater. Res.60 (2009) 11-15.
[28]. S. Zhang, S. Cheng, Micro Nano Lett. 6 (2011) 55-562.
[29]. G. Grace Ninan, C. Sudhakartha, K. P. Vijaya Kumal, Sol. Energy Mater. Sol. Cells 157 (2016) 229-233.
[30]. A. Dussan, F. Mesa, G. Gordillo, J. Mater. Sci 45 (2010) 2403-2407.
[31]. T. H. Sajeesh, C. Sudhakartha, C. Sanjeeviraja, T. Abe, Y. Kashiwada, K. P. VijayaKuma, J. Phys. D. Appl. Phys. 43 (2010) 445102.
[32]. K. Santosh Kumar, C. Manoharan, S. Dhanapandian, A. Gori Manohari, Spectrochim. Acta Part A 115 (2013) 840-844.
[33]. N. Ali, S. Ajmal, M. Shah, R. Ahmed, B. Ul-haq, A. Shaari, Chalco. Lett. 10 (2014) 503-508.